汽車電子產(chǎn)品集成電路的失效分析

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中圖分類號：U463.6 文獻標識碼：A 文章編號：1003-8639（2025）06-0165-03

FailureAnalysisofIntegrated Circuitsin Automotive ElectronicProducts

Li Zhibin

（Shanghai Huabi Testing Technology Co.，Ltd.，Shanghai 215ooO，China）

【Abstract】This paper focuses on the failure problem of integrated circuits inautomotive electronic products. Takingacertain profesional technicalserviceplatform project asanexample，itcomprehensivelyuses methods such as appearance inspection，functional inspection，non-destructive testing，and destructive testing to testthesamplechipof theinfrared detection module.The failure modes identified were solderball voids，solderbonding atthefet，warping， etc.The failure mechanisms were related tothe weldingquality，internal stress，circuit bridging，etc.Through thermal stresssimulationverification，itwasfoundthatthestabilityoftheassemblyandwelding processafectsthe welding quality，and a high parameterdrift rate willincrease the product defect rate.To this end，improvement measures such as strengthening processcontrolandadding high-temperaturebakingprocessesare proposed toefectively eliminate therisk of product failure and increase the domestic production rate of chips and project benefits.

【KeyWords】integrated circuit；failure；non-destructive testing；simulation verification

0 引言

伴隨汽車電器元器件技術(shù)高速發(fā)展，其運行可靠性成為車企關(guān)注重點。（剩余3415字）