基于力導(dǎo)向算法的國(guó)產(chǎn)繼電保護(hù)裝置熱優(yōu)化方法

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摘要：為保證變電站繼電保護(hù)裝置的運(yùn)行可靠性，突破原有僅憑經(jīng)驗(yàn)進(jìn)行熱設(shè)計(jì)與分析的局限，對(duì)國(guó)產(chǎn)核心芯片與板卡進(jìn)行精準(zhǔn)建模，采用力導(dǎo)向算法優(yōu)化熱源布局。通過(guò)精細(xì)化熱分析及實(shí)驗(yàn)驗(yàn)證表明：本方法改善了板卡局部熱點(diǎn)與溫度梯度分布，增加了國(guó)產(chǎn)化繼電保護(hù)裝置的熱安全余量，提升了裝置在工程現(xiàn)場(chǎng)長(zhǎng)期運(yùn)行的可靠性。

關(guān)鍵詞：國(guó)產(chǎn)芯片；繼電保護(hù)裝置；精準(zhǔn)建模；力導(dǎo)向算法；精細(xì)化熱分析；可靠性

中圖分類號(hào)：TK123文獻(xiàn)標(biāo)志碼：A文章編號(hào)：1671-5276（2024）06-0205-06

Abstract：To ensure the operation reliability of relay protection devices in substations， by breaking through the limitations of the original thermal design and analysis merely based on experience， builds precise models of domestic core chips and printed circuit boards， and optimizes the layout of heat sources by using force-directed algorithm. The refined thermal analysis and experimental verification indicate that the optimized method improves the local hot spot and temperature gradient distribution of the pcb， increases the thermal safety margin of the domestic relay protection device， and reinforces the long-term operation reliability of the device on project site.

Keywords：domestic chip; relay protection device; precise modeling; force-directed algorithm; refined thermal analysis; reliability

0引言

長(zhǎng)期以來(lái)，變電站繼電保護(hù)裝置CPU、FPGA等核心芯片完全依賴進(jìn)口，隨著中美貿(mào)易摩擦加劇，尤其是美國(guó)《2022芯片與科學(xué)法案》的簽署，使自主可控、安全可靠成為智能電網(wǎng)的重要發(fā)展方向［1-2］，繼電保護(hù)裝置芯片自主化進(jìn)程進(jìn)一步加速。（剩余6047字）