SCM協(xié)議下美國芯片產(chǎn)業(yè)補(bǔ)貼政策的國際合規(guī)性研究

[中圖分類號]D996[文獻(xiàn)標(biāo)識碼]A[文章編號]1671-8372（2025）02-0067-09

Study on the international compliance of US chip industrial subsidy policy under the AgreementonSubsidiesandCountervailingMeasures

YANGMeng-sha，LIUXing-yue （LawSchool，Tianjin University，Tianjin 30oo72，China）

Abstract：With the localization and regionalization transformation of global supply chains，major economies worldwidehaveprioritized thesecurityandautonomyofsupplychains toaddresstheriskofdisruptionsarising from the highinterdependenceof globalsupplychains.Asthechipindustryisatthecoreoftechnologicalcompetition，the U.S. enacted theCreatingHelpful Incentives toProduceSemiconductorsand ScienceActtoreshape theglobalchipsupply chainthrough governmentsubsidies fordomesticchip manufacturing.Theincentive measures forthechipindustryunder thisActfallwithinthedefinitionofsubsidies under the Agreementon SubsidiesandCountervailingMeasures.While thesemeasuresarediffcult toconstitute prohibitedsubsidies，theymeet theconstituentelements foractionablesubsidies andthus violate theobligations under theAgreementon Subsidiesand Countervailing Measures.Chinaand other WTO members affected bytheActshouldactivelyutilize the WTOdisputesettement mechanisms，improve the trade remedy legal systems，and safeguard the legitimate interests of the chip industries in accordance with law.

Keywords：Agreementon Subsidiesand CountervailingMeasures;CHIPSand ScienceAct;industrialsubsidies; international compliance

一、引言

芯片是數(shù)字技術(shù)、人工智能、清潔能源等高新技術(shù)產(chǎn)業(yè)發(fā)展必不可少的關(guān)鍵產(chǎn)品，芯片產(chǎn)業(yè)已成為中美技術(shù)競爭及各國供應(yīng)鏈安全布局的核心領(lǐng)域。（剩余15184字）